Method of manufacturing a sensor device with binding...

Details Method of manufacturing a sensor device with binding... Method of manufacturing a sensor device with binding...

2007-05-29

2007-05-29

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S782000, C257S783000, C257S784000, C257S785000, C257S786000, C438S617000

Reexamination Certificate

active

11046793

ABSTRACT:
A sensor device includes a sensor chip and a bonding wire being fixed on a substrate. The sensor device is manufactured by using a binding material made of an adhesive containing a foaming agent that evaporates upon exposure to heat. The binding material reduces its elasticity after a wire bonding process because voids being functional as a cushion are formed by evaporation of the foaming agent.

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Notice of Preliminary Rejection from Korean Patent Office issued on Apr. 26, 2006 for the corresponding Korean patent application No. 10-2005-0009188 (a copy and English translation thereof).
Office Communication from European Patent Office issued on Oct. 20, 2006 for the corresponding European patent application No. 05 002 056.9-2213 (a copy thereof).

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