Method of manufacturing a semiconductor package with a bump...

Details Method of manufacturing a semiconductor package with a bump... Method of manufacturing a semiconductor package with a bump...

2008-11-26

2010-11-23

Dickey, Thomas L (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21499, C257SE21503

Reexamination Certificate

active

07838332

ABSTRACT:
A method of manufacturing a semiconductor package with a bump using a carrier. One embodiment provides forming a bump on a carrier. A gap is formed in the carrier that undercuts the bump. A semiconductor chip is attached to the carrier. The chip is electrically connected to the bump. An encapsulant is deposited into the gap. The carrier is removed from the bump.

REFERENCES:
patent: 6159770 (2000-12-01), Tetaka et al.
patent: 2002/0074147 (2002-06-01), Tan et al.
patent: 2004/0175864 (2004-09-01), Mahle
patent: 2005/0242417 (2005-11-01), Youn et al.
patent: 2005/0258521 (2005-11-01), Park et al.
patent: 2005/0260795 (2005-11-01), Park et al.
patent: 2010/0029046 (2010-02-01), Camacho et al.
patent: 2010/0124802 (2010-05-01), Chiang et al.
Quirk et al, “Semiconductor Manufacturing Technology”, 2001, Prentice-Hall, Inc., pp. 435-445.

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