Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-09-13
2005-09-13
Owens, Douglas W. (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000
Reexamination Certificate
active
06943064
ABSTRACT:
The semiconductor device includes tub5that is smaller than semiconductor chip8, and which supports semiconductor chip8; molded section12that is formed by resin-molding around semiconductor chip8; suspension leads4, including supporting portions4athat support tub5and exposed portions4bthat are connected to supporting portions4aand are exposed on back surface12aof molded section12, and are elevation processed in supporting portions4a; leads2that are located around tub5; and wires10that connect pads7of the semiconductor chip8with the corresponding leads2; wherein the thickness of tub5and supporting portions4aof suspension leads4is less than the thickness of exposed portions4b, and back surface8bof semiconductor chip8is firmly in contact with molding resin11.
REFERENCES:
patent: 5942794 (1999-08-01), Okumura et al.
patent: 2001/0041424 (2001-11-01), Matsuura et al.
patent: 11-74440 (1999-03-01), None
Hitachi Yonezawa Electronics Co., Ltd.
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Owens Douglas W.
Renesas Technology Corp.
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