Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-03-27
2007-03-27
Pizarro, Marcos D. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S123000, C257SE21506
Reexamination Certificate
active
10811999
ABSTRACT:
A lead frame comprises a stage for mounting a semiconductor chip thereon, a plurality of leads arranged in the periphery of the stage, and a plurality of lead interconnection members (e.g., dam bars) for interconnecting the leads, wherein a plurality of through holes are formed to penetrate through the lead frame in a thickness direction with respect to the leads or the lead interconnection members so as to allow a plurality of cutting lines to pass therethrough, whereby the leads are subjected to cutting and are made electrically independent of each other. A semiconductor package of a QFN type is produced by enclosing the lead frame within a molded resin, from which the leads are partially exposed to the exterior and are subjected to plating and are then subjected to cutting at the cutting lines.
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Dickstein , Shapiro, LLP.
Pizarro Marcos D.
Yamaha Corporation
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