Method of manufacturing a semiconductor package using a carrier

Details Method of manufacturing a semiconductor package using a carrier Method of manufacturing a semiconductor package using a carrier

2011-07-12

2011-07-12

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C257SE21502

Reexamination Certificate

active

07977161

ABSTRACT:
A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherein the post extends into and is located within a periphery of the encapsulant slot and the terminal extends into the encapsulant slot, mechanically attaching a semiconductor chip to the post, electrically connecting the chip to the terminal, depositing an encapsulant in the encapsulant slot, and removing the carrier from the terminal.

REFERENCES:
patent: 4615857 (1986-10-01), Baird
patent: 5756379 (1998-05-01), Haghiri-Tehrani
patent: 6159770 (2000-12-01), Tetaka et al.
patent: 2005/0148117 (2005-07-01), Huang
patent: 2005/0218499 (2005-10-01), Chang et al.
patent: 2005/0224968 (2005-10-01), Ho
patent: 2008/0224293 (2008-09-01), Hin

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