Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate
2005-05-10
2005-05-10
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Incorporating resilient component
C438S118000, C438S123000, C257S668000, C257S782000, C257S784000
Reexamination Certificate
active
06890796
ABSTRACT:
A method of manufacturing a semiconductor package including a substrate for mounting and fixing a semiconductor ship thereon and a connecting pattern, includes providing the substrate with an elongate opening formed therein, fixing the semiconductor chip with its surface mounted on the substrate and with its electrode being aligned within the elongate opening, and electrically an electrode of the semiconductor chip to the connecting pattern via wires through the elongate opening. The elongate opening and the wires then are sealed with resin.
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IBM Technical Disclosure Bulletin, vol. 24, No. 6, dated 11/81, pp. 3017-3018, entitled “Vacuum Wafer Pick-Up Tip,” by J.G. Ferrentino and L.H. Rosenfeld.
Le Dung A.
Oki Electric Industry Co. Ltd.
Volentine Francos & Whitt PLLC
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