Method of manufacturing a semiconductor light emitting device

Details Method of manufacturing a semiconductor light emitting device Method of manufacturing a semiconductor light emitting device

1998-03-26

2000-12-05

Mulpuri, Savitri

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

438462, H01L 21302

Patent

active

061565849

ABSTRACT:
Deposited on a wafer-like substrate for forming a plurality of light emitting device chips is a semiconductor layer laminate with a different property from that of the substrate. Then, electrodes are provided on and in electric connection with a top semiconductor layer of a first conductivity type of the semiconductor layer laminate, and on and in electric connection with a semiconductor layer of a second conductivity type, exposed by locally etching the semiconductor layer laminate, in association with the individual chips. Then, the semiconductor layer laminate is etched at boundary portions between the chips to expose the substrate, and the substrate is broken at the exposed portions into the chips. As the semiconductor layer laminate is etched out at the boundary portions between the chips before breaking the wafer, breaking can be facilitated without damaging the light emitting portions of the semiconductor layer laminate. This helps provide high-performance semiconductor light emitting devices.

REFERENCES:
patent: 5148190 (1992-09-01), Cholewa et al.
patent: 5248792 (1993-09-01), Forster et al.
patent: 5310967 (1994-05-01), Kaneno et al.
patent: 5593815 (1997-01-01), Ahn
patent: 5904548 (1999-05-01), Orcutt
patent: 5939735 (1999-08-01), Tsutsui et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a semiconductor light emitting device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor light emitting device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor light emitting device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-960783