Method of manufacturing a semiconductor leadframe structure

Details Method of manufacturing a semiconductor leadframe structure Method of manufacturing a semiconductor leadframe structure

1995-05-30

1996-09-24

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 29850, H01R 4300

Patent

active

055578420

ABSTRACT:
A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29) includes a bond post (31) that has a major surface (32) for forming a wire bond. The major surface (32) includes an exposed area (33) of leadframe metal (23) and a covered area (34) of another metal (24) deposited onto the leadframe metal (23).

REFERENCES:
patent: 4859631 (1989-08-01), Barre
patent: 4947236 (1990-08-01), Suga et al.
patent: 5049973 (1991-09-01), Satriano et al.
patent: 5277356 (1994-01-01), Kawauchi
patent: 5338704 (1994-08-01), Imai et al.
patent: 5459350 (1995-10-01), Date et al.

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