Method of manufacturing a semiconductor IIL device with dielectr

Fishing – trapping – and vermin destroying

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437 34, 437 55, 437 61, 437 70, H01L 21265

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056935439

ABSTRACT:
n type epitaxial layers are formed on the main surface of a p type semiconductor substrate. A field oxide film is selectively formed in the surface of n type epitaxial layers. An n type diffusion region is formed in n type epitaxial layers positioned directly under field oxide film. A base region and a collector region are respectively formed in the surface of n type epitaxial layer positioned between field oxide films. As a result, a semiconductor device having an IIL circuit is obtained which can suppress the parasitic bipolar operation between base regions, reduce the junction capacitance between the base region and the emitter region and which can be reduced in size.

REFERENCES:
patent: 4115797 (1978-09-01), Hingarh et al.
patent: 4260430 (1981-04-01), Itoh et al.
patent: 4274891 (1981-06-01), Silvestri et al.
patent: 4338139 (1982-07-01), Shinada
patent: 4377903 (1983-03-01), Kanzaki et al.
patent: 4512075 (1985-04-01), Vora
patent: 4539742 (1985-09-01), Kamzaki et al.
patent: 4546539 (1985-10-01), Beasom
patent: 4550491 (1985-11-01), Depey
patent: 5331198 (1994-07-01), Kanda et al.
Wiedmann et al., "High-Speed Split-Emitter I.sup.2 L/MTS Memory Cell," IEEE Journal of Solid-State Circuits, vol. SC-16, No. 5, Oct. 1981, pp. 429-434.
Crippen et al., "High-Performance Integrated Injection Logic: A Microprogram Sequencer Built with I.sup.3 L," IEEE Journal of Solid-State Circuits, vol. SC-11, No. 5, Oct. 1976, pp. 662-668.
Journal of Institute of Electronics, Information and Communication Engineers of Japan, Feb. 1978, pp. 192-193.

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