Method of manufacturing a semiconductor device with an airtight

Details Method of manufacturing a semiconductor device with an airtight Method of manufacturing a semiconductor device with an airtight

1994-06-15

2000-04-11

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

438118, 438122, 438123, 438124, H01L 2152, H01L 2156, H01L 2158, H01L 2160

Patent

active

060487542

ABSTRACT:
A process for manufacturing a package of a semiconductor device, and providing a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide moisture-proofness.

REFERENCES:
patent: 3762039 (1973-10-01), Douglas et al.
patent: 3930114 (1975-12-01), Hodge
patent: 3981074 (1976-09-01), Yamamoto et al.
patent: 4717948 (1988-01-01), Sakai et al.
patent: 4875087 (1989-10-01), Miyauchi et al.
patent: 4953002 (1990-08-01), Nelson et al.
patent: 4961106 (1990-10-01), Butt et al.
patent: 4965659 (1990-10-01), Sasame et al.
patent: 4975761 (1990-12-01), Chu
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5034800 (1991-07-01), Maschisi
patent: 5049977 (1991-09-01), Sako
patent: 5063434 (1991-11-01), Emoto
patent: 5089879 (1992-02-01), Komenaka

Affiliated with

Also associated with

Rating

Method of manufacturing a semiconductor device with an airtight does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device with an airtight , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device with an airtight will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1175979