Fishing – trapping – and vermin destroying
Patent
1993-12-22
1996-01-09
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437226, 437 67, 148DIG12, H01L 21301
Patent
active
054828872
ABSTRACT:
A method of manufacturing semiconductor devices with a passivated semiconductor body (1) provided with an electrode (2) and fastened on an electrically conducting support body (3), in which method a slice of semiconductor material (5) is fastened on a surface (6) of an electrically conducting auxiliary slice (7), and mesa structures (8) are formed in the slice of semiconductor material (5) by the application of grooves (9) in the slice of semiconductor material (5) subsequently, a layer of insulating material (10) is provided on the walls of the grooves (9), electrodes (2) are provided on upper sides (11) of the mesa structures (8), and the auxiliary slice (7) with the mesa structures (8) is split up at the areas of the grooves (9) into individual semiconductor bodies (1) each fastened on its own support body (3). According to the invention, the electrodes (2) are provided in that an electrically conducting layer (25) is deposited both on the upper side (11) of the mesa structures (8) and on the layer of insulating material (10) and, during splitting-up of the auxiliary slice (7) with mesa structures (8), this layer (25) is also split up into separate electrodes (2) which lie on the upper side (11) of a mesa structure (8) as well as on the layer of insulating material (10). The method according to the invention is simpler than a known method. Moreover, semiconductor devices are made by the method according to the invention which have a better resistance to higher voltages because the electrodes (2) also extend over the insulating material (10).
REFERENCES:
patent: 3579815 (1971-05-01), Gentry
patent: 3852876 (1974-12-01), Sheldon et al.
patent: 3881162 (1975-04-01), Caddock
patent: 4080621 (1978-03-01), Funakawa et al.
patent: 4179794 (1979-12-01), Kosugi et al.
patent: 4904609 (1990-02-01), Temple
patent: 5124274 (1992-06-01), Ohki et al.
patent: 5254212 (1993-10-01), Someji et al.
patent: 5393711 (1995-02-01), Biallas et al.
Duinkerken Geert J.
Fonville Roelvinus M. M.
Biren Steven R.
Chaudhuri Olik
Mulpuri S.
U.S. Philips Corporation
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