Method of manufacturing a semiconductor device with a brazing mo

Details Method of manufacturing a semiconductor device with a brazing mo Method of manufacturing a semiconductor device with a brazing mo

1998-09-28

1999-12-07

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438119, 438122, H01L 2144, H01L 2148, H01L 2150

Patent

active

05998239&

ABSTRACT:
A method of manufacturing a semiconductor device with a mount 2 secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.

REFERENCES:
patent: 3813587 (1974-05-01), Umeda et al.
patent: 4862247 (1989-08-01), Derryberry et al.
Patent Abstracts of Japan, vol. 096, No. 002, Feb. 29, 1996, JP 07273258 A, (Mitsubishi Electric Corp.), Oct. 1995.

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