Method of manufacturing a semiconductor device utilizing monocry

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29578, 29579, 29580, 148175, 148187, 156 3, 156 13, 156 17, 156612, 357 40, 357 48, 357 49, 357 50, 357 59, 427 88, 427259, 427272, H01L 2120, H01L 2176

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039973786

ABSTRACT:
In the manufacture of a semiconductor device, when an epitaxially-grown layer is formed on a semiconductor substrate partially formed with an oxide, a polycrystalline layer is formed on the oxide; the polycrystalline part is used as an isolation region for elements to be formed in the epitaxially-grown layer. The oxide for growing the polycrystalline layer is buried and formed in the semiconductor substrate at a depth at which a breakdown voltage between the elements is attained, whereby the width of the isolation region can be made small, so as to increase the density of integration of the semiconductor device.

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