Semiconductor device manufacturing: process – Gettering of substrate – By layers which are coated – contacted – or diffused
Reexamination Certificate
2007-06-19
2007-06-19
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Gettering of substrate
By layers which are coated, contacted, or diffused
C438S491000
Reexamination Certificate
active
09724403
ABSTRACT:
In a method of crystallizing a semiconductor film by introducing a metallic element that promotes crystallization, a gettering thereafter is effectively performed. A material film having a high tensile stress, typically a silicon nitride film, is formed in contact with the semiconductor film or heated after the formation thereof, thereby the metallic element in a crystalline semiconductor film is gettered to the material film having a high tensile stress. Thus, the metallic Interstitial silicon density element is removed or reduced to thereby form a gettered region.
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Fish & Richardson P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Smoot Stephen W.
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