Method of manufacturing a semiconductor device including a stati

Details Method of manufacturing a semiconductor device including a stati Method of manufacturing a semiconductor device including a stati

1990-09-19

1992-02-18

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437475, 437203, 437911, 437178, 437179, 148DIG12, H01L 21283

Patent

active

050894315

ABSTRACT:
A semiconductor device (10) is formed by providing first and second semiconductor bodies (1 and 11) each having first and second major surfaces (2 and 3) and (12 and 13), respectively, defining a rectifying junction pattern (21) adjacent to at least one (12) of the first major surfaces, and bonding the first major surfaces (2 and 12) together to join the two semiconductor bodies (1 and 11) to form the semiconductor device (10) in which the rectifying junction pattern 21 defines a path for the flow of charge carriers between the second major surfaces. The rectifying junction pattern (21) is defined at the one first major surface (12) by an electrically conductive pattern (20) forming a Schottky junction (21) with at least one of the first and second semiconductor bodies (1 and 11).

REFERENCES:
patent: 4181542 (1980-01-01), Yoshida et al.
patent: 4451843 (1984-05-01), Dahlberg
patent: 4468683 (1984-08-01), Dahlberg
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 4674174 (1987-06-01), Kishita et al.
European Search Report, EP 90 20 2803.

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