Method of manufacturing a semiconductor device having leads...

Details Method of manufacturing a semiconductor device having leads... Method of manufacturing a semiconductor device having leads...

2005-11-08

2005-11-08

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S617000

Reexamination Certificate

active

06962836

ABSTRACT:
A semiconductor device comprises a plurality of inner leads extending around a semiconductor chip, a tape substrate supporting the semiconductor chip and joined to respective end portions of the inner leads, wires connecting the inner leads and pads formed on a main surface of the semiconductor chip, a seal portion formed by resin-sealing the semiconductor chip and the wires, and a plurality of outer leads linking in a line with the inner leads and protruded from the seal portion to the exterior of four directions. A relationship between a length (a) of a shorter side of the semiconductor chip and a clearance (b) from the semiconductor chip, to a tip of the inner leads arranged at the farthest location from the semiconductor chip isa≦2b. It is possible to attain a narrow pad pitch, and mount the semiconductor chip formed in a small size, and standardize the lead frame.

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