Method of manufacturing a semiconductor device having dummy patt

Semiconductor device manufacturing: process – Making device array and selectively interconnecting

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Details

438129, 438183, H01L 2182

Patent

active

059465573

ABSTRACT:
A semiconductor device comprises a plurality of wiring formed on a lower insulating film to be spaced apart from each other, dummy patterns formed on the lower insulating layer between the plurality of wiring and spaced apart from each other, and an upper insulating layer formed to cover the plurality of wiring and the dummy patterns and having therein cavities formed in regions between the plurality of wiring and the dummy patterns.

REFERENCES:
patent: 5293503 (1994-03-01), Nishigoori
patent: 5430325 (1995-07-01), Sawada et al.

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