Method of manufacturing a semiconductor device having a semicond

Fishing – trapping – and vermin destroying

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437 24, 437 26, 437 27, 148DIG1, 148DIG147, H01L 2124, H01L 21265

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052368726

ABSTRACT:
A method of manufacturing a semiconductor device in which a thin buried silicide layer is formed by implantation includes the step of first forming an amorphous layer by implantation, which layer is then converted into the buried silicide layer by a heat treatment. A sufficiently thin buried silicide layer, of about 10 nm thickness, can be obtained in this manner, and the resulting structure is suitable, for example, for the manufacture of a metal-base transistor.

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Sanchez, et al., "Silicide Formation by High Dose . . . " Proc. of Mat. Res. Soc. Symp., vol. 51, 1986, pp. 439-444.
Rausch, et al., "Palladium Silicide Contact . . . ", IBM Tech. Disc. Bull., vol. 24, No. 7A, Dec. 1981, p. 3453.
"Thermal Regrowth of Silicon After High-dose Ar+ Implantation", by Kalitzova et al, Nuclear Instruments & Methods in Physics Research Section B, vol. B17, No. 4, Nov. 1986, pp. 331-333.
"Silicide Formation by Direct Metal Implantation", by Kozicki, Extended Abstracts/Electrochemical Society, vol. 87-2, 1987, pp. 968-969.

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