Method of manufacturing a semiconductor device having a lead bon

Details Method of manufacturing a semiconductor device having a lead bon Method of manufacturing a semiconductor device having a lead bon

1975-02-26

1976-05-18

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29580, 357 45, 357 56, B01J 1700

Patent

active

039568202

ABSTRACT:
An improved method of manufacturing a semi-conductor device having a lead bonded to a surface thereof, wherein the device is fabricated by removing a section of a substrate which surrounds a surface portion of the substrate comprising the surface to which the lead is bonded, includes bonding the lead to the surface portion of the substrate prior to removing the section.

REFERENCES:
patent: 3786560 (1974-01-01), Cunningham

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