Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-06-07
2005-06-07
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000
Reexamination Certificate
active
06902955
ABSTRACT:
Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is provided, then a block molding is performed so as to cover the plural device areas in a lump on a chip bearing surface side of the film substrate, and thereafter the film substrate is subjected to dicing wherein a cutting blade is advanced toward a block molding portion to divide the film substrate device area by device area in accordance with a down cutting method, whereby peeling of the substrate in the dicing work can be prevented.
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Fourson George
Kebede Brook
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Renesas Technology Corp.
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