Method of manufacturing a semiconductor device by using a...

Details Method of manufacturing a semiconductor device by using a... Method of manufacturing a semiconductor device by using a...

2008-07-22

2008-07-22

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S458000, C438S106000, C438S127000

Reexamination Certificate

active

07402502

ABSTRACT:
A method of manufacturing a semiconductor device includes providing a matrix frame which includes a plurality of die pads, mounting a semiconductor chip on the respective die pads, and sealing the semiconductor chip in blocks. After the semiconductor chip is sealed by the sealing resin, inner leads which are extended from the sealing resin are punched by a punching blade. Then, the block is diced to individual semiconductor devices by a rotary blade.

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