Method of manufacturing a semiconductor device by forming pyrami

Fishing – trapping – and vermin destroying

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437230, 437947, H01L 21441

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active

055277349

ABSTRACT:
By using an electroless metallization bath to which a stabilizer is added which suppresses the cathodic partial reaction, pyramid-shaped bumps (53) can be grown on the bond pads of semiconductor devices without lateral overgrowth of the coating layer 3. The angle of inclination a is a function of the concentration of the stabilizer.

REFERENCES:
patent: Re29285 (1977-06-01), Christini et al.
patent: 4028200 (1977-06-01), Dockus
patent: 4122215 (1978-10-01), Vratny
patent: 4419390 (1983-12-01), Feldstein
patent: 4483711 (1984-11-01), Harbulak et al.

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