Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating has specified thickness variation
Reexamination Certificate
2007-01-16
2007-01-16
Nguyen, Nam (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating has specified thickness variation
C205S137000, C205S138000, C205S123000
Reexamination Certificate
active
10923874
ABSTRACT:
There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plating layer; an anisotropic conductive material provided on the first plating layer; and a conductive material provided on the second plating layer, wherein the first plating layer has appropriate adhesion properties with the anisotropic conductive material, and the second plating layer has appropriate adhesion properties with the conductive material.
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Nguyen Nam
Oliff & Berridg,e PLC
Seiko Epson Corporation
Van Luan V.
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