Method of manufacturing a semiconductor device by detachably mou

Details Method of manufacturing a semiconductor device by detachably mou Method of manufacturing a semiconductor device by detachably mou

1998-09-29

2000-04-25

Chaudhari, Chandra

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

438107, 438155, 438164, H01L 2130, H01L 2146, H01L 2100, H01L 2184, H01L 2144

Patent

active

06054371&

ABSTRACT:
Disclosed is a method of manufacturing a semiconductor device, comprising the step of detachably mounting a plurality of semiconductor substrates to a first holder board so as to form a complex semiconductor substrate, and the step of subjecting the plural semiconductor substrates included in the complex semiconductor substrates to common steps of manufacturing a semiconductor device. At least one of the plural semiconductor substrates is mounted to a second holder board. The particular semiconductor substrate is detached from the second holder board and, then, mounted to the first holder board. Alternatively, at least one of the plural semiconductor substrates is detached from the first holder board and, then, mounted to a third holder board differing in size from the first holder board.

REFERENCES:
patent: 4409724 (1983-10-01), Tasch
patent: 5032543 (1991-07-01), Black
patent: 5073230 (1991-12-01), Maracas
patent: 5455202 (1995-10-01), Malloy
patent: 5869373 (1999-02-01), Wen

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