Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1998-03-02
2000-06-20
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156344, 29764, 269903, 118503, B32B 3100
Patent
active
060765852
ABSTRACT:
A method of manufacturing a semiconductor device includes providing an apparatus (210, 510) having tabs (212, 214, 412, 414) for holding and separating semiconductor substrates wherein a first tab (212, 412) is different from a second tab (214, 414), using the first tab (212, 412) to support a semiconductor substrate (224) wherein the second tab (214, 414) does not support the semiconductor substrate (224), and exposing the semiconductor substrate (224) to a chemical to move the semiconductor substrate (224) towards the second tab (214, 414) without removing the semiconductor substrate (224) from the apparatus (210, 510).
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Chen George C.
Klingbeil, Jr. Lawrence Scott
Dover Rennie William
Lorin Francis J.
Motorola Inc.
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