Method of manufacturing a semiconductor device and an apparatus

Details Method of manufacturing a semiconductor device and an apparatus Method of manufacturing a semiconductor device and an apparatus

1996-12-26

2000-08-08

Powell, William

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

216 89, 216 38, B08B 600, B44C 122

Patent

active

060986387

ABSTRACT:
In a CMP process for flatting a surface of a film on a semiconductor wafer, ionized water is used as rinsing liquid in the post-polishing step performed after the main CMP polishing step. With ionized water as rinsing liquid, abrasive particles adhered to the film surface during the main polishing step are removed.

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"Novel Electrolysis--Inonized--Water Cleaning Technique For The Chemical-Mechanical Polishing (CMP) Process"; Aoki et al; 1994; abstract only; 1994 Symposium on VLSI Tech. Digest of Tech. Papers.
N. Miyashita et al., "A New Post CMP Cleaning Method For Trench Isolation Process", Chemical-Mechanical-Polishing (CMP-MIC 96), p. 161.
"Postchemical-Mechanical Planarization Cleanup Process for Interlayer Dielectric Films"; Roy et. al.; pp. 216-225; Jan. 1995; Roy et. al.; J. Elect. Soc.; vol. 142 (1).

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