Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2005-06-07
2005-06-07
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C428S041300
Reexamination Certificate
active
06902944
ABSTRACT:
The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame21, and a rubber film22arranged within the outer frame21and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film22increases, the wafer-fixing jig20deforms the rubber film and allows the tapes2and6arranged between the wafer1and the rubber film22A to be pushed toward the wafer1gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
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Hayasaka Noboru
Shimobeppu Yuzo
Shinjo Yoshiaki
Teshirogi Kazuo
Watanabe Mitsuhisa
Armstrong Kratz Quintos Hanson & Brooks, LLP
Fujitsu Limited
Le Thao P.
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