Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-03-21
2006-03-21
Chaudhari, Chandra (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S465000
Reexamination Certificate
active
07015069
ABSTRACT:
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
REFERENCES:
patent: 5759873 (1998-06-01), Kata et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5882956 (1999-03-01), Umehara et al.
patent: 5904502 (1999-05-01), Ference
patent: 5914531 (1999-06-01), Tsunoda et al.
patent: 6228684 (2001-05-01), Maruyama
patent: 6245595 (2001-06-01), Nguyen et al.
patent: 6287895 (2001-09-01), Sato
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6333564 (2001-12-01), Katoh et al.
patent: 6346433 (2002-02-01), Maeda et al.
patent: 6358776 (2002-03-01), Takehara et al.
patent: 6495379 (2002-12-01), Iketani
patent: 2001/0003049 (2001-06-01), Fukasawa et al.
patent: 2002/0089062 (2002-07-01), Saran et al.
patent: 0 853 337 (1998-07-01), None
patent: 0 971 401 (2000-01-01), None
patent: 7-321248 (1995-12-01), None
patent: 08-051258 (1996-02-01), None
patent: 08-142106 (1996-06-01), None
patent: 10-244556 (1998-09-01), None
patent: 10-256286 (1998-09-01), None
patent: 11-16930 (1999-01-01), None
patent: 2000-12578 (2000-01-01), None
patent: 2000-077572 (2000-03-01), None
patent: 2000-138246 (2000-05-01), None
patent: 2000-228566 (2000-08-01), None
patent: 2000-277551 (2000-10-01), None
English-Language Translation of JP 2000-138246, Published May 16, 2000.
Patent Abstracts of Japan.
Hashizume Takanori
Ichitani Masahiro
Imura Kenichi
Matsuura Takao
Miwa Takashi
Chaudhari Chandra
Hitachi ULSI Systems Co. Ltd.
Hitachi Yonezawa Electronics Co., Ltd.
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Renesas Technology Corp.
LandOfFree
Method of manufacturing a semiconductor device and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a semiconductor device and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device and a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3584021