Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-03-29
2005-03-29
Chaudhari, Chandra (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
Reexamination Certificate
active
06872597
ABSTRACT:
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
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English-Language Translation of JP 2000-138246, Published May. 16, 2000, Patent Abstracts of Japan.
Hashizume Takanori
Ichitani Masahiro
Imura Kenichi
Matsuura Takao
Miwa Takashi
Chaudhari Chandra
Hitachi ULSI Systems Co. Ltd.
Hitachi Yonezawa Electronics Co., Ltd.
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Renesas Technology Corp.
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