Metal working – Method of mechanical manufacture – Obtaining plural product pieces from unitary workpiece
Patent
1987-02-17
1988-02-02
Schmidt, Frederick R.
Metal working
Method of mechanical manufacture
Obtaining plural product pieces from unitary workpiece
29423, 29846, 51283R, 437226, B23P 1700
Patent
active
047221305
ABSTRACT:
Disclosed is a method of manufacturing a semiconductor device which comprises the step of forming grooves in the form of a grid on the upper surface of a semiconductor wafer formed with elements, the step of grinding or polishing the underside of the semiconductor wafer to thereby reduce the thickness thereof, the step of applying a first single-sided, self-adhesive sheet onto the underside of the semiconductor wafer, and the step of stretching the second single-sided, self-adhesive sheet so as to space out each other a multiplicity of semiconductor chips divided along the gridlike grooves of the semiconductor wafer. Each semiconductor chip is picked up and mounted on a lead frame.
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Japanese Patent Disclosure (KOKAI) No. 57-145339, Sep. 8, 1982.
Kato Toshihiro
Kimura Takashi
Kabushiki Kaisha Toshiba
Schmidt Frederick R.
Showalter Robert
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