Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2009-08-03
2010-10-19
Ha, Nathan W (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257SE21505
Reexamination Certificate
active
07816185
ABSTRACT:
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
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Kinoshita Mitsuru
Munakata Tadashi
Oosaka Shingo
Takahashi Noriyuki
Yamaguchi Yoshihiko
Ha Nathan W
Miles & Stockbridge P.C.
Renesas Electronics Corporation
Renesas Northern Japan Semiconductor, Inc.
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