Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C257SE21505

Reexamination Certificate

active

07579216

ABSTRACT:
A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

REFERENCES:
patent: 6448151 (2002-09-01), Tateishi
patent: 6596561 (2003-07-01), Takahashi et al.
patent: 6646334 (2003-11-01), Hur
patent: 7148126 (2006-12-01), Mita
patent: 7239337 (2007-07-01), Ogihara et al.
patent: 2002/0041016 (2002-04-01), Hyodo et al.
patent: 2002/0074639 (2002-06-01), Kim et al.
patent: 2004/0032013 (2004-02-01), Cobbley et al.
patent: 2005/0156309 (2005-07-01), Fujii et al.
patent: 2000-077363 (2000-03-01), None
patent: 2001-023936 (2001-01-01), None
patent: 2001-024003 (2001-01-01), None
patent: 2001-077057 (2001-03-01), None
patent: 2001-085449 (2001-03-01), None

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