Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

1987-05-21

1988-08-16

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 174 52FP, 174 52PE, 357 70, 357 74, H05K 334

Patent

active

047634073

ABSTRACT:
A semiconductor device mounted on a printed circuit board is disclosed. The semiconductor device is surrounded by a frame having a stopper portion on the inner wall thereof at a level higher than tops of bonding wires as well as a semiconductor element housed in the frame. An insulating resin is filled in the frame to protect the semiconductor element from external stress and humidity. A method of mounting a semiconductor device on a printed circuit board is further disclosed. In this method a sealing solid resin block is first sustained on a stopper portion provided on the inner wall of a frame surrounding a semiconductor element and bonding wires, and then melted to seal the semiconductor element and bonding wires.

REFERENCES:
patent: 3622419 (1971-11-01), London
patent: 3706840 (1972-12-01), Moyle et al.
patent: 4218701 (1980-08-01), Shirasaki
patent: 4264917 (1981-04-01), Ugon
patent: 4483067 (1984-11-01), Parmentier
patent: 4642716 (1987-02-01), Wakabayashi et al.

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