Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2007-07-24
2007-07-24
Vinh, Lan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S015000, C438S026000, C438S750000
Reexamination Certificate
active
11260182
ABSTRACT:
The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.
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Ito Fujio
Kameoka Akihiko
Miyaki Yoshinori
Nishi Kunihiko
Nishita Takafumi
Antonelli, Terry Stout & Kraus, LLP.
Hitachi ULSI Systems Co. Ltd.
Renesas Technology Corp.
Vinh Lan
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