Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2007-05-22

2007-05-22

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE33057

Reexamination Certificate

active

11117481

ABSTRACT:
In a lead frame, through holes are formed outside suspending leads and trenches are formed on a back surface along the suspending leads so as to communicate with the through holes. When sealing resin is injected into cavities of a resin molding die, air enters the through holes through air vents and flows out from the through holes by a resin injection pressure in the trenches, making it easier for the sealing resin to enter the through holes. Since the sealing resin leaking to the air vents can be injected into the through holes, it is possible to enhance the bonding force between the sealing resin after curing and the lead frame in the vicinity of the air vents and effect release of the resin molding die, while allowing the sealing resin leaking to the air vents to remain on the lead frame side without remaining within the air vents.

REFERENCES:
patent: 7112471 (2006-09-01), Boon et al.
patent: 2001/0032985 (2001-10-01), Bhat et al.
patent: 2002/0001869 (2002-01-01), Fjelstad
patent: 2002/0123163 (2002-09-01), Fujii
patent: 2005/0284578 (2005-12-01), Uchida et al.
patent: 2005-151625 (2002-05-01), None

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