Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2006-12-12

2006-12-12

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S118000, C257S777000, C257S783000, C257SE27137

Reexamination Certificate

active

07148081

ABSTRACT:
In a semiconductor device in which a plurality of semiconductor chips are stacked on a mounting substrate, an adhesive material formed of resin mainly having a thermosetting property is applied to a semiconductor chip mounting region on the mounting substrate. After mounting semiconductor chips on the adhesive material, the adhesive material is cured by heat treatment. When these parts are naturally cooled to a normal temperature, the mounting substrate warps in a convex shape due to the difference in an α value between the mounting substrate and the semiconductor chip. However, pads are connected by wire bonding and, an adhesive material formed of resin having a thermoplastic property is laminated to the semiconductor chip. Then, a spacer chip is bonded to the adhesive material by thermal compression bonding. Accordingly, due to heat generated at the time of thermal compression bonding, the mounting substrate and the semiconductor chip become substantially flat.

REFERENCES:
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6351028 (2002-02-01), Akram
patent: 6387728 (2002-05-01), Pai et al.
patent: 6503776 (2003-01-01), Pai et al.
patent: 6657290 (2003-12-01), Fukui et al.
patent: 6759745 (2004-07-01), Masumoto et al.
patent: 6867500 (2005-03-01), Corisis et al.
patent: 2003/0162325 (2003-08-01), Tan et al.
patent: 06-244360 (1994-09-01), None
patent: 2003-078106 (2003-03-01), None

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