Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2006-03-21

2006-03-21

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

With vibration step

C438S463000

Reexamination Certificate

active

07015071

ABSTRACT:
A method of manufacture of a semiconductor device can speedily peel extremely thin chips which are laminated to an adhesive tape without generating cracks or chippings. In this regard, the head of a vibrator is brought into contact with a back surface of an adhesive tape to which a plurality of semiconductor chips are laminated. By applying longitudinal vibrations having a frequency of 1 kHz to 100 kHz and an amplitude of 1 μm to 50 μm, the chip is peeled from the adhesive tape. In applying the longitudinal vibrations to the adhesive tape, a tension in a horizontal direction is applied to the adhesive tape.

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patent: 6558975 (2003-05-01), Sugino et al.
patent: 6820331 (2004-11-01), Kishimoto et al.
patent: 2003/0094621 (2003-05-01), Teramae et al.
patent: 05-003242 (1993-01-01), None
patent: 06-295930 (1994-10-01), None
patent: 2003-264203 (2003-09-01), None

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