Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2005-12-27

2005-12-27

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S127000, C438S464000

Reexamination Certificate

active

06979593

ABSTRACT:
A semiconductor device is manufactured by covering a main surface of a wafer with protective tape, grinding a back side of the wafer to form an extremely thin wafer and affixing it to a dicing tape, dicing to form extremely thin semiconductor chips, picking up the chips and fixing each picked-up chip to a product forming area on a wiring substrate, removing the protective tape, performing wire bonding, covering the chips and wires of the wiring substrate with an insulating resin layer, forming bump electrodes on a back side of the wiring substrate, cutting the wiring substrate affixed to a support member together with the insulating resin layer, thereby forming plural semiconductor devices, and removing each semiconductor device from the support member.

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