Method of manufacturing a semiconductor device

Metal treatment – Compositions – Heat treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148187, H01L 2126

Patent

active

041013441

ABSTRACT:
In Locos N-channel MOST-IC's underpasses can be obtained below the locos pattern by performing, at the area where the underpasses are to be formed, an As or Sb implantation prior to providing the locos. By using the nitride mask as an implantation mask, the locos and the source/drain zones of the transistors can be provided in a self-registering manner with respect to the underpasses.

REFERENCES:
patent: 3873372 (1975-03-01), Johnson
patent: 4013489 (1977-03-01), Oldham

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-337189

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.