Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

1995-09-29

1998-03-03

Picardat, Kevin

Fishing, trapping, and vermin destroying

437 3, 437205, 437215, 437217, H01L 2160

Patent

active

057233632

ABSTRACT:
A method of making a data access arrangement (DAA) device. The method includes providing a substrate with a DAA circuit, containing optically active electrical components, mounted on it and individually encapsulating each optically active component with an optical medium. An opaque material is transfer molded about the substrate to completely encase the substrate and all of the circuit components. Before the transfer molding, a lead frame is attached to the substrate that extends through and beyond the opaque material to enable electrical contact with the substrate and the circuit components.

REFERENCES:
patent: 5032542 (1991-07-01), Kazami et al.
patent: 5096852 (1992-03-01), Hobson
patent: 5389578 (1995-02-01), Hopson et al.
patent: 5472915 (1995-12-01), Schairer et al.

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