Method of manufacturing a semiconductor device

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148188, 148189, 29577C, 29571, H01L 21223, H01L 21225

Patent

active

043759998

ABSTRACT:
A method of manufacturing a semiconductor device for simultaneously forming a plurality of diffused regions of selectively different diffusion depths, comprises forming polycrystalline semiconductor layers of corresponding, selectively different depths on the semiconductor substrate surface provided with a diffusion mask having a plurality of diffusion windows. By the impurity diffusion into the substrate through the windows at the polycrystalline semiconductor layer interface with the substrate, a comparatively shallow diffused region and a comparatively deep diffused region are formed simultaneously by a single diffusion process, respectively, under the comparatively thick polycrystalline semiconductor layer and the comparatively thin polycrystalline semiconductor layer.

REFERENCES:
patent: 3793094 (1974-02-01), Strack et al.
patent: 4029527 (1977-06-01), Glasl et al.
patent: 4063973 (1977-12-01), Kirita et al.
patent: 4074304 (1978-02-01), Shiba
patent: 4125426 (1978-11-01), Inayoshi et al.
patent: 4197147 (1980-04-01), Bergmann et al.
patent: 4224088 (1980-09-01), Komatsu et al.
patent: 4305760 (1981-12-01), Trudel

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1733671

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.