Method of manufacturing a semiconductor component with a low...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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Details

C257S666000, C257SE21506, C257SE21505, C257SE23031, C438S124000

Reexamination Certificate

active

07939380

ABSTRACT:
A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed.

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patent: 5826328 (1998-10-01), Brady et al.
patent: 6019037 (2000-02-01), Larson
patent: 2002/0076852 (2002-06-01), Paulus et al.
patent: 2004/0084759 (2004-05-01), Miyagawa
patent: 2005/0263864 (2005-12-01), Islam et al.
patent: 2006/0292752 (2006-12-01), Connell et al.
patent: 2007/0205492 (2007-09-01), Wang
patent: 2008/0036099 (2008-02-01), Theuss et al.

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