Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-05-10
2011-05-10
Pizarro, Marcos D (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S666000, C257SE21506, C257SE21505, C257SE23031, C438S124000
Reexamination Certificate
active
07939380
ABSTRACT:
A method for manufacturing a semiconductor component that includes a leadframe having a non-metallic base structure and an intermediate leadframe structure. The non-metallic base structure may be, among other things, paper, cellulose, or plastic. A layer of electrically conductive material is formed over the non-metallic base structure. A circuit element attach structure and a plurality of leadframe leads are formed from the layer of electrically conductive material. A circuit element is coupled to the circuit element attach structure and electrically coupled to the plurality of leadframe leads. The circuit element is encapsulated and at least the non-metallic base structure is removed. Alternatively, a plurality of leadframe leads may be formed on the electrically conductive layer and a circuit element is placed over the electrically conductive layer. The circuit element is electrically coupled to the plurality of leadframe leads and encapsulated. The non-metallic base structure and the electrically conductive layer are removed.
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Krishnan Shutesh
Kumar Jatinder
Wang Soon Wei
Dover Rennie William
Gupta Raj
Pizarro Marcos D
Semiconductor Components Industries LLC
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