Method of manufacturing a semiconductor component

Details Method of manufacturing a semiconductor component Method of manufacturing a semiconductor component

1997-09-22

1999-07-27

Pyon, Harold

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

264276, 264279, 2643289, 425127, 4251291, 425544, 425572, 425588, B29C 4502, B29C 4514

Patent

active

059285958

ABSTRACT:
A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

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patent: 5372758 (1994-12-01), Lundstrom et al.
patent: 5454705 (1995-10-01), Bauk

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