Method of manufacturing a semiconductor chip

Details Method of manufacturing a semiconductor chip Method of manufacturing a semiconductor chip

1998-05-20

2000-08-22

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438460, 438462, H01L 2146

Patent

active

061071633

ABSTRACT:
In a method of manufacturing a semiconductor chip, a wire is traveled in one way to cut a wafer into a plurality of chips while a wire train where wires are arranged by pitches of scribe lines is brought into contact with the scribe lines of the wafer linearly, and an abrasive solution is supplied to a contact portion thereof.

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patent: 5314844 (1994-05-01), Imamura
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patent: 5362681 (1994-11-01), Roberts, Jr. et al.
patent: 5609148 (1997-03-01), Mitwalsky et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5904546 (1999-05-01), Wood et al.

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