Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-08-20
1994-02-15
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156228, 156311, 1565831, B32B 3120
Patent
active
052863255
ABSTRACT:
The present invention provides a method of manufacturing a seat comprising a skin material, a cushioning pad and a seat frame by bonding the skin material and the cushioning pad to each other by using a reactive hot melt adhesive, wherein the method comprises a step of coating an adhesive to the cushioning pad, a step of assembling the seat frame to an attaching die in which a movable press bonding plate is disposed, a step of attaching a cushioning pad to the seat frame assembled to the attaching die, provisionally assembling the skin material to the surface of the cushioning pad on the side of coating the adhesive and then moving the press bonding plate thereby arranging the seat frame, the cushioning pad and the skin material on an attaching die main body, a step of applying heating by a heating die from the side of the skin material attached in the assembling step and a cooling/press bonding step of applying cooling under pressure after the heating step by a cooling die from the surface of the skin material to the attaching die.
REFERENCES:
patent: 3318636 (1967-05-01), Callum
patent: 3669498 (1972-06-01), Meyers et al.
patent: 4795517 (1989-01-01), Elliot et al.
patent: 5066351 (1991-11-01), Knoll
Hashiguchi Shuichi
Miyota Akihiro
Ball Michael W.
Crispino Richard
Tokyo Seat Co., Ltd.
LandOfFree
Method of manufacturing a seat using adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a seat using adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a seat using adhesive will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1203932