Method of manufacturing a sealed electronic module

Details Method of manufacturing a sealed electronic module Method of manufacturing a sealed electronic module

2006-12-12

2006-12-12

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000, C174S521000

Reexamination Certificate

active

07146721

ABSTRACT:
A circuit board is inserted into an open-ended housing and potting material is dispensed onto the exposed face of the circuit board in a single step to seal the circuit board to the housing. One or more electrical interconnects such as a connector header or a ribbon cable attached to the circuit board extend upward through the potting material so that the potting material also forms an environmental seal around the electrical interconnects.

REFERENCES:
patent: 4249229 (1981-02-01), Hester
patent: RE31704 (1984-10-01), Hester
patent: 4871319 (1989-10-01), Babow
patent: 4928082 (1990-05-01), Yagi et al.
patent: 5319522 (1994-06-01), Mehta
patent: 5703754 (1997-12-01), Hinze
patent: 5739463 (1998-04-01), Diaz et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a sealed electronic module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a sealed electronic module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a sealed electronic module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3655509