Method of manufacturing a SAW device

Details Method of manufacturing a SAW device Method of manufacturing a SAW device

2005-03-25

2008-12-23

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S594000, C029S846000, C204S192110, C204S192150, C204S192170

Reexamination Certificate

active

07467447

ABSTRACT:
In a SAW device comprising a piezoelectric single crystal substrate and electrodes on a surface thereof, the substrate is obtained by slicing a LiTaO3or LiNbO3material such that a plane containing axis X and perpendicular to a new axis Y obtained by rotating axis Y about axis X by an angle of 33°±9° becomes the substrate surface, and each electrode is a layered film including a titanium nitride layer and an aluminum layer thereon. The aluminum layer containing no grain boundaries ensures high efficiency, long life SAW devices experiencing no increase of electrical resistance.

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