Method of manufacturing a rigid-flex printed wiring board

Details Method of manufacturing a rigid-flex printed wiring board Method of manufacturing a rigid-flex printed wiring board

1992-06-30

1993-11-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 174254, 361749, H05K 302

Patent

active

052632482

ABSTRACT:
A method of manufacturing a rigid-flex printed wiring board comprises a first step of forming a substrate composition by attaching adhesive layers to both surfaces of a flexible substrate, a second step of forming notches in portions of each of the rigid substrates which correspond to the boundaries between rigid portions and a flexible portion of a rigid-flex printed wiring board prior to the first step such that neither a plating solution nor an etching solution enters the spaces between the flexible substrate and the rigid substrates from the outer atmosphere of the substrate composition, a third step of forming through holes in the flexible substrate and plating them after the first step, a fourth step of cutting an unwanted peripheral portion of the substrate composition after the third step, and a fifth step of removing portions of each rigid substrate which are disposed between the notches.

REFERENCES:
patent: 3546775 (1970-12-01), Lalmond et al.
patent: 4037047 (1977-07-01), Taylor
patent: 4338149 (1982-07-01), Quaschner
patent: 4715928 (1987-12-01), Hamby
patent: 4800461 (1989-01-01), Dixon et al.
patent: 5048166 (1991-09-01), Wakamatsu
patent: 5142448 (1992-08-01), Kober et al.
patent: 5144534 (1992-09-01), Kober
patent: 5144742 (1992-09-01), Lucas et al.

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