Method of manufacturing a resin-sealed semiconductor device

Details Method of manufacturing a resin-sealed semiconductor device Method of manufacturing a resin-sealed semiconductor device

1994-01-24

1995-06-27

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437209, 437211, 437214, 437219, H01L 2160

Patent

active

054279380

ABSTRACT:
A method of manufacturing a resin-sealed semiconductor device includes the steps of: supporting and fixing a supporting plate in a set of molds using a positioning pin with a sharp pin point which is inserted into the molds to have a predetermined clearance from the supporting plate; injecting a sealing resin 11 into a cavity formed in the molds; and removing the positioning pin from the molds after the sealing resin 11 hardens. This method increases the life of the positioning pin, facilitates the removal of a semiconductor device from the molds, and achieves a semiconductor device with good insulation.

REFERENCES:
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4649637 (1987-03-01), Hatakeyama
patent: 4888307 (1989-12-01), Spairisano et al.
patent: 4981776 (1991-01-01), Yoshimura
patent: 5091341 (1992-02-01), Asada et al.
patent: 5288667 (1994-02-01), Taruya et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a resin-sealed semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a resin-sealed semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a resin-sealed semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-286690