Metal working – Method of mechanical manufacture – Electrical device making
Patent
1990-10-23
1991-08-27
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 430312, 156643, 156656, 156657, 156663, H01K 310
Patent
active
050421484
ABSTRACT:
A probing card for wafer testing has a plurality of probes arranged so as to correspond to and come in contact with a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer. The probing card comprises a base plate, contact fingers and wiring sections. The base plate is formed of photosensitive glass. The base plate defines through holes extending from one of its main surfaces to the other. The contact fingers are formed as columnar elements filling the through holes and having a cross-sectional area decreasing from opposite ends to an intermediate position thereof. Each contact finger has one end thereof projecting from one of the main surfaces of the base plate. This projecting end of each contact finger at least defines a substantially planar end face. The wiring sections comprise conductive layers formed in a predetermined pattern on the other main surface of the base plate and connected respectively to the other ends of the contact fingers. The through holes are formed in the photosensitive glass base plate by photolithography. The contact fingers may be positioned with high precision relative to a plurality of bonding pads. A stable contact is secured between the bonding pads and contact fingers.
REFERENCES:
patent: 3813773 (1974-06-01), Parks
patent: 4059480 (1977-11-01), Ruh et al.
patent: 4066491 (1978-01-01), Ruh et al.
patent: 4647476 (1987-03-01), Anthony
patent: 4851767 (1989-07-01), Halbout et al.
patent: 4961052 (1990-10-01), Tada et al.
L. Younkin "Thin-Film-Hybrid Wafer-Probe Card Promises Speed and Density", Electronics Test (May 1989), pp. 26-30.
B. Leslie and F. Matta, "Membrane Probe Card Technology (The Future for High Performance Wafer Test)", 1988 International Test Conference, Paper 30.1, pp. 601-607.
Tektronix Preliminary Performance Information "P6521, P6522, P6523 Very High Density Probe Cards for VLSI Testing Applications".
Tada Tetsuo
Takagi Ryouichi
Echols P. W.
Mitsubishi Denki & Kabushiki Kaisha
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